Qualcom多款产品 安全漏洞

Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 NDP application 存在安全漏洞，该漏洞源于信息长度验证不正确可能导致缓冲区溢出。以下产品及版本受影响：APQ8096AU, AQT1000, AR8031, AR8035, AR9380, CSR8811, CSRA6620, CSRA6640, CSRB31024, FSM10055, FSM10056, IPQ4018, IPQ4019, IPQ4028, IPQ4029, IPQ5010, IPQ5018, IPQ6000, IPQ6005, IPQ6010, IPQ6018, IPQ6028, IPQ8064, IPQ8065, IPQ8068, IPQ8070, IPQ8070A, IPQ8071, IPQ8071A, IPQ8072, IPQ8072A, IPQ8074, IPQ8074A, IPQ8076, IPQ8076A, IPQ8078, IPQ8078A, IPQ8173, IPQ8174, PM3003A, PM4125, PM4250, PM456, PM6125, PM6150, PM6150A, PM6150L, PM6250, PM6350, PM640A, PM640L, PM640P, PM660, PM660A, PM660L, PM7150A, PM7150L, PM7250, PM7250B, PM7350C, PM8004, PM8005, PM8008, PM8009, PM8150, PM8150A, PM8150B, PM8150C, PM8150L, PM8250, PM8350, PM8350B, PM8350BH, PM8350BHS, PM8350C, PM855, PM855B, PM855L, PM855P, PM8998, PMC1000H, PMD9655, PMI632, PMI8998, PMK7350, PMK8002, PMK8003, PMK8350, PMM6155AU, PMM8155AU, PMM8195AU, PMM855AU, PMM8996AU, PMP8074, PMR525, PMR735A, PMR73