Qualcomm 芯片安全漏洞

Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 存在安全漏洞，该漏洞源于在处理 ION 句柄时内核释放问题导致内存损坏，以下产品和版本受到影响：APQ8009, APQ8009W, APQ8017, APQ8053, APQ8096AU, AQT1000, CSRB31024, MDM9150, MDM9206, MDM9250, MDM9607, MDM9626, MDM9628, MDM9640, MDM9650, MSM8909W, MSM8917, MSM8937, MSM8953, MSM8996AU, PM8937, QCA4020, QCA6174A, QCA6175A, QCA6310, QCA6320, QCA6335, QCA6420, QCA6430, QCA6564A, QCA6564AU, QCA6574, QCA6574A, QCA6574AU, QCA6584, QCA6595AU, QCA6696, QCA9367, QCA9377, QCA9379, QCN7605, QCN7606, QCS603, QCS605, Qualcomm215, SA415M, SD429, SD439, SD450, SD632, SD660, SD670, SD710, SD820, SD835, SD845, SD855, SDM429W, SDW2500, SDX20, SDX24, SDXR1, WCD9326, WCD9330, WCD9335, WCD9340, WCD9341, WCN3610, WCN3615, WCN3620, WCN3660, WCN3660B, WCN3680, WCN3680B, WCN3980, WCN3990、WCN3998、WSA8810、WSA8815。